Get in touch about GlobalData Company reports
Contact the team or request a demo to find out how our data can drive your business forward
View up-to-date information on Powertech Technology Inc patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US11437336B2 | Grant | Semiconductor package structure with landing pads and manufacturing method thereof | H01L21/4803; H01L21/4846; H01L21/561; H01L2224/24011; H01L2224/2402; H01L2224/24175; H01L2224/2518; H01L2224/82005; H01L23/3128; H01L24/24; H01L24/25; H01L24/82 | September 06, 2022 |
| US11410945B2 | Grant | Semiconductor package having partial outer metal layer and packaging method thereof | H01L21/56; H01L23/31; H01L23/5386; H01L23/66; H01L24/96; H01L25/0655; H01Q1/2283 | August 09, 2022 |
| TWI768294B | Grant | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | H01L21/481; H01L21/4853; H01L21/4857; H01L21/56; H01L21/561; H01L21/565; H01L21/568; H01L21/6835; H01L21/78; H01L22/32; H01L2221/68345; H01L2221/68359; H01L2221/68372; H01L2224/0231; H01L2224/02311; H01L2224/02313; H01L2224/02331; H01L2224/02379; H01L2224/02381; H01L2224/0401; H01L2224/04105; H01L2224/05572; H01L2224/11334; H01L2224/11462; H01L2224/11849; H01L2224/12105; H01L2224/13024; H01L2224/13083; H01L2224/16145; H01L2224/16227; H01L2224/1716; H01L2224/214; H01L2224/32145; H01L2224/32225; H01L2224/73204; H01L2224/92125; H01L2224/97; H01L23/16; H01L23/24; H01L23/31; H01L23/3128; H01L23/3675; H01L23/4824; H01L23/49811; H01L23/49816; H01L23/49822; H01L23/49833; H01L23/49838; H01L23/5385; H01L23/5386; H01L23/5389; H01L23/552; H01L23/562; H01L24/03; H01L24/05; H01L24/13; H01L24/14; H01L24/16; H01L24/17; H01L24/19; H01L24/20; H01L24/32; H01L24/73; H01L24/92; H01L24/96; H01L24/97; H01L25/0652; H01L25/0655; H01L25/16; H01L25/18; H01L25/50; H01L2924/18162 | June 21, 2022 |
| TWI768552B | Grant | STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF | H01L21/4803; H01L21/56; H01L2224/32225; H01L2224/48091; H01L2224/48227; H01L2224/73265; H01L2224/83191; H01L2224/92247; H01L2225/0651; H01L2225/06527; H01L2225/06568; H01L2225/06572; H01L2225/06575; H01L2225/06586; H01L23/16; H01L23/29; H01L24/10; H01L24/32; H01L25/04; H01L25/0657; H01L25/50; H01L2924/00014; H01L2924/15311; H01L2924/181 | June 21, 2022 |
| US11367641B2 | Grant | Wafer storage device, carrier plate and wafer cassette | H01L21/67379 | June 21, 2022 |
Top Inventors by Filings (Count by publication)
| Name | Count |
|---|
Still looking?
Have you found what you were looking for? From start-ups to market leaders, uncover what they do and how they do it.
Explorer
Access more premium companies when you subscribe to Explorer