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View up-to-date information on Vicor Corp patents, including inventor and filing insights.
Patent Trends
Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
---|---|---|---|---|
US11398770B1 | Grant | Delivering power to semiconductor loads | H01L24/26; H02M1/0074; H02M1/08; H05K1/0298; H05K1/144 | July 26, 2022 |
US11336167B1 | Grant | Delivering power to semiconductor loads | H01L24/26; H02M1/0074; H02M1/08; H05K1/0298; H05K1/144 | May 17, 2022 |
US11324107B1 | Grant | Panel molded electronic assemblies with multi-surface conductive contacts | H01L21/44; H01L23/053; H01L23/057; H01L23/147; H01L23/28; H05K1/0204; H05K1/111; H05K1/181; H05K1/186; H05K2201/1003; H05K3/0014; H05K3/0026; H05K3/0044; H05K3/0079; H05K3/16; H05K3/18; H05K3/207; H05K3/24; H05K3/381; Y10T29/49146 | May 03, 2022 |
US11304297B1 | Grant | Panel molded electronic assemblies with integral terminals | H05K1/113; H05K1/116; H05K1/181; H05K1/184; H05K3/243; H05K3/3405; H05K3/429 | April 12, 2022 |
US11290005B1 | Grant | Power bus voltage drop compensation using sampled bus resistance determination | H02M1/0019; H02M3/00 | March 29, 2022 |
Top Inventors by Filings (Count by publication)
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