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View up-to-date information on Tianshui Huatian Technology Co Ltd patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| CN114023717A | Application | Double-base-island lead frame with single exposed special-shaped radiating fin | H01L23/49541; H01L23/49568 | February 08, 2022 |
| CN114005794A | Application | Magnetic induction type voltage isolation IC packaging structure and preparation method thereof | H01L21/56; H01L2224/48091; H01L2224/48247; H01L2224/49171; H01L2224/73265; H01L23/293; H01L23/31; H01L23/495; H01L23/564; H01L2924/181 | February 01, 2022 |
| CN113745171A | Application | Chip stacking packaging structure provided with step cavity, and manufacturing method thereof | H01L21/4853; H01L21/4857; H01L21/486; H01L23/13; H01L23/49816; H01L23/49822; H01L23/49827; H01L24/81; H01L25/0657; H01L25/18 | December 03, 2021 |
| CN113725069A | Application | Wafer film pasting process optimization method | H01L21/6836; H01L21/02013; H01L2221/68327 | November 30, 2021 |
| CN113707636A | Application | RGBLED packaging substrate for display | H01L23/544; H01L23/49579; H01L25/0753; H01L23/49503; H01L23/49568 | November 26, 2021 |
Top Inventors by Filings (Count by publication)
| Name | Count |
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