BE Semiconductor Industries NV - Company Profile
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View up-to-date information on BE Semiconductor Industries NV patents, including inventor and filing insights.
Patent Trends
Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
---|---|---|---|---|
MY192150A | Grant | THROUGH-TYPE FURNACE AND DIE BONDER WITH A THROUGH-TYPE FURNACE | F27B9/045; F27B9/20; F27B9/3077; F27B9/32; F27B9/34; F27D1/04; F27D1/1808; F27D3/0084; F27D5/0037; H01L21/67011; H01L21/67121; H01L21/67126; H01L2221/67; H01L24/742; H01L24/81 | August 02, 2022 |
MA52827B1 | Grant | Procédé et dispositif de séparation sélective de composants électroniques d'un cadre comprenant des composants électroniques | H01L21/67092; H01L21/67271; H01L21/78; H01L2223/54433; H01L2223/54486; H01L23/544 | June 30, 2022 |
KR102394745B1 | Grant | METHOD AND APPARATUS FOR MOUNTING ELECTRONIC OR OPTICAL COMPONENTS ON A SUBSTRATE | H01L21/67144; H01L2224/75823; H01L2224/7592; H01L24/75; Y10T156/10; Y10T156/17 | May 04, 2022 |
MY190081A | Grant | APPARATUS AND METHOD FOR MOUNTING COMPONENTS ON A SUBSTRATE | G05B2219/45031; H01L21/52; H01L21/67121; H01L21/67132; H01L21/67144; H01L21/67259; H01L21/67276; H01L21/681; H01L22/20; H01L2224/75753; H01L2224/75824; H01L2224/75842; H01L2224/7598; H01L2224/81121; H01L24/741; H01L24/75; H05K13/0413; H05K13/046; H05K13/0815 | March 25, 2022 |
MY190001A | Grant | TRANSPORT MEMBER FOR TRANSPORTING PLATE-SHAPED SUBSTRATES WHICH ARE TO BE ELECTROLYTICALLY GALVANIZED IN A BATH, AND DEVICE FOR AND METHOD OF ELECTROLYTICALLY GALVANIZING SUCH SUBSTRATES | B65G15/58; B65G49/02; C25D17/007; C25D17/06; C25D3/22; C25D5/011; C25D5/34; C25D7/126 | March 22, 2022 |
Top Inventors by Filings (Count by publication)
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