View up-to-date information on Semtech Corp patents, including inventor and filing insights.
Patent Trends
| Publication Identifier | Document Type | Title | Classification-CPC | Publication Date |
|---|---|---|---|---|
| US20220285334A1 | Application | Semiconductor Device and Method of Stacking Semiconductor Die for System-Level ESD Protection | H01L21/76898; H01L2224/04042; H01L2224/05611; H01L2224/05644; H01L2224/05655; H01L2224/1132; H01L2224/11462; H01L2224/11901; H01L2224/13111; H01L2224/13155; H01L2224/32245; H01L2224/45124; H01L2224/45139; H01L2224/45147; H01L2224/48247; H01L2224/8082; H01L2224/94; H01L2225/0651; H01L23/295; H01L23/49575; H01L23/60; H01L24/13; H01L24/14; H01L24/16; H01L24/81; H01L24/85; H01L24/94; H01L24/97; H01L25/0657; H01L25/50; H01L2924/10252; H01L2924/143; H01L2924/1461 | September 08, 2022 |
| CN112953593B | Grant | LoRa高级接收器 | H04B1/1638; H04B1/69; H04B1/7085; H04B1/7087; H04B2001/6912; H04L1/206; H04L27/103; H04L27/265; H04L27/2662 | September 02, 2022 |
| CN114999947A | Application | 形成小z半导体封装的方法和半导体器件 | H01L21/486; H01L21/56; H01L21/561; H01L21/563; H01L21/565; H01L21/568; H01L2224/0401; H01L2224/04105; H01L2224/10; H01L2224/12105; H01L2224/16146; H01L2224/19; H01L2224/32145; H01L2224/32245; H01L2224/73204; H01L2224/73259; H01L2224/73267; H01L2224/82001; H01L2224/83005; H01L2224/92125; H01L2224/92244; H01L2224/94; H01L2225/1035; H01L2225/1058; H01L23/28; H01L23/31; H01L23/3128; H01L23/3171; H01L23/367; H01L23/481; H01L23/49816; H01L23/49827; H01L23/52; H01L23/528; H01L23/5389; H01L23/562; H01L24/10; H01L24/11; H01L24/12; H01L24/19; H01L24/20; H01L24/27; H01L24/28; H01L24/93; H01L24/96; H01L24/97; H01L25/105; H01L25/50; H01L2924/10252; H01L2924/10253; H01L2924/10272; H01L2924/10322; H01L2924/10324; H01L2924/10329; H01L2924/1033; H01L2924/10335; H01L2924/141; H01L2924/143; H01L2924/1433; H01L2924/14335; H01L2924/1434; H01L2924/1461; H01L2924/18161; H01L2924/18162; H01L2924/3511 | September 02, 2022 |
| EP3540771B1 | Grant | SCHUTZSCHALTUNG MIT EINER FET-VORRICHTUNG, DIE VON EINEM GESCHÜTZTEN BUS MIT DER MASSE GEKOPPELT IST | H01L27/0255; H01L27/0262; H01L27/0274; H01L27/0285; H01L29/73; H02H9/005; H02H9/025; H02H9/04; H02H9/041; H02H9/046; H03K17/08116 | August 31, 2022 |
| CN114978143A | Application | 用于CMOS信号路径的前馈电流补偿 | G05F1/10; G05F1/56; G05F1/565; G05F1/577; G11C11/4074; H02M1/0045; H02M1/15; H02M3/07; H03K17/04206; H03K17/16; H03K17/56; H03K19/0013; H03K19/00315; H03K19/00361; H03K19/00384; H03K19/017545; H03K19/018571 | August 30, 2022 |
Top Inventors by Filings (Count by publication)
| Name | Count |
|---|
Still looking?
Have you found what you were looking for? From start-ups to market leaders, uncover what they do and how they do it.
Explorer
Access more premium companies when you subscribe to Explorer
Get in touch about GlobalData Company reports
Contact the team or request a demo to find out how our data can drive your business forward